Flyer - Die Bonder
The assembly of power semiconductors (IGBT, diodes) on the substrates is more or less a standard process. Our solution offers the advantage that the power semiconductor can be directly assembled from the wafer onto the substrates in a large-scale oven carrier. Thus, the repositioning of the substrates from a small workpiece carrier into the oven carrier can be skipped.
Moreover, the power semiconductors have a large edge length and are quite thin, which requires an ejection from wafer with a needle bed. Thereby no cracks in the chip occur. Even inaccurately mounted wafers can automatically be oriented in their rotational position and correctly aligned to the portal, so that the multiple needles do not miss the chip.
If needed, the assembling of the preforms and the power semiconductor as well as the dispensing of a bonding agent, can be realized on the same machine, depending on the cycle time requirements.