Desktop Dispenser

The IP-500 Desktop Dispenser is a multifunctional dispensing system with a wide variety of application possibilities. It is highly suitable for precise dispense applications in laboratories, for prototypes and in the flexible production of small batches.

The machine is delivered as a desktop model. It is equipped with linear axis, which can be positioned in a μm range. The speed of the axes is limited, so that the system can be run safely without a safety cover.

In the base configuration, an internal time/pressure dispensing unit is included. At the dispensing axis, different dispensing valves can be equipped. The selection includes time/pressure, precision micro- screw, jet dispensing valves and piston valves from different manufacturers.

The simple graphical user interface allows a fast and flexible creation of programs and dispensing patterns. Volume or weight based dispensing processes can be realized as easy as 3D structures.

Flyer - IP-500 Desktop Dispenser

IC-900 Dispensing Cell

The robust and fast dispensing cell allows highly precise dispensing processes for the manufacturing of various products. The system can be run stand-alone as well as integrated in a line.

Multiple axis can be autonomously used in parallel. A wide selection of dispensing valves from different manufacturers – time/pressure, precision micro-screw, jet dispense valves and piston valves – are ready to be mounted at the dispensing axis. . In combination with the integrated vision system, standard applications such as Underfill, Glob-Top or Conformal Coating are possible as well as complex 2D or 3D dispensing tasks.

The IC-900 Dispensing Cell is designed for precise, reliable and safe dispensing processes.

Flyer - IC-900 Dispensing Cell

Taping Machine

The feeding of parts in blister tapes is a well-known standard in electronics production. To make the advantages of this feeding method accessible to other industries, Infotech developed the taping machine.

With this system, all kind of parts can be packed flexibly and reliably from bulk material into blister tapes.

By default, the machine is equipped with a taping unit including a hot-seal unit, assembly head, vision system and vibratory feeder.

If needed, the parts can be visually inspected and sorted, greased or treated in some other way before taping. Ask us about the possibilities!

Power Module Die Bonder

In contrast to classical die bonding, power module manufacturing has special requirements. In general, power MOSFET's, IGBT's and diodes are ejected from the wafer and placed on a DBC substrate supplied in large workpiece carriers. The Infotech Power Module Die Bonder has the advantage of a big work area, which allows placing the products directly onto the workpiece carrier of the vacuum oven, without reloading the substrates.

Moreover, solder preforms can be fed to the machine directly from reel and then cut and placed.

To fix the power semiconductor, either a bonding agent can be dispensed or a graphite jig or other weights could be automatically put on top of the assembly.

Sinter Bonder

The sinter bonder fulfills die attach requirements for power electronics exceeding standard die bonder capabilities from laboratory (batch processing) up to series production as fully automated inline system.

The highly flexible die bonder is equipped with sintering process specific components out of Infotech`s component matrix. Heated bond head with high force capabilities, substrate pre-heater and heater station with integrated force measurement, DTF feeder and more are part of the Infotech sinter bonder.

For larger die sizes, the sinter bonder pre-sinters (tacks) the die onto the DBC (substrate) where a sinter press performs the final sinter process. For smaller dies e.g. LED’s the sinter bonder can completely sinter the LED onto the substrate.

Flyer - Sinter Bonder

Desktop Sinter Bonder

The desktop sinter bonder dedicated for presinter- and sinter applications with wide open application range for manual, semi automated or fully automated operations.

The Lab solution to develop pre-sinter processes with production equivalent process peripherals – for initial series production where the process parameters can be merged into the final production line solution.

Out of Infotech’s component matrix the system is
equipped with sintering process specific components, i.e. heated bond head with high force capabilities, heated substrate holder plate with manual tilt adjustment and integrated force sensing table, two heated bond heads and more.

Flyer - Desktop Sinter Bonder

Preforms Assembler

Solder preforms are often used in power semiconductor modules or in sensors manufacturing to avoid the application of flux.

Infotech offers the feeding and processing possibility of solder preforms from a reel instead of precut preforms in waffle trays. The standard Preforms Assembler can be equipped with up to four feeders, which are able to cut different widths of preforms in the required length directly on the machine. These preforms can afterwards be picked and placed precisely with up to four assembly heads. With the vision system, each step of the process can be monitored and controlled.

The feeders are exchangeable while the assembler is in operation. On an external setup station, they are prepared for the next use.

OEM: ONYX Family

The machines of the ONYX family supplied by ZEVAC AG, stand for high quality rework and prototype producton of electronic assemblies.

With a wide range of differnt machine types, even challenging application requirements can be covered. A comprehensive options program is available, too.

Every single machine out of the ONYX Family is developed and fitted to run lead-free applications. The use of appropriate materials, nitrogen input and a 2000 W top and 6000 W bottom heater guarantee reliable and repeatable thermo profiles and soldering results. Thus, the machines are suitable to manage the future demand of the electonics industry.

With the right equipment from the ONYX Family, applicatons that use components in SMT, CSP, microBGA, flip chip, LGA packages as well as RF shields or connectors and odd-shaped components can be reliably reworked.

Further info and sales via www.zevac.com