In addition to classic die bonding, there are various applications in the semiconductor technology, which are difficult or even impossible to be mastered with standard machines. Infotech offers with its Component Matrix the necessary flexibility to fulfill special tasks such as the relative placement or bonding of the smallest dies with an edge length down to 200 µm. The active control and the correction of the plane-parallelism, the fixation of dies with UV adhesive during the placement, Eutectic bonding, chip-on-chip or chip-on-wafer stacking as well as the processing of very thin wafers are all within our areas of expertise.

Our flexibility includes application-specific software solutions such as the handling of wafer map data, traceability and communication with external host systems via SECS/GEM commands.

Infotech AG
Vogelherdstrasse 4
4500 Solothurn
T +41 32 626 86 00
F +41 32 626 86 09